导热绝缘硅胶片的优点及性能
The advantages and properties of silicon film thermal insulation

**降低散热器以及散热结构件的工艺工差要求，弥合结构工艺工差**
** reduce the radiator and radiating structure of the process requirements, bridge structure technology and difference**

导热硅胶片厚度,软硬度可根据设计的不同进行调节,因此在导热通道中可以弥合散热结构，芯片等尺寸工差,降低对结构设计中对散热器件接触面的工差要求,特别是对平面度,粗糙度的工差,目前行业内高良率的散热器加工尺寸工差为+/-0.25mm,平面度为0.15mm/30mmx30mm，如果提高加工精度则会在很大程度上提高产品成本，因此导热硅胶片可以充分增大发热体与散热器件的接触面积，降低了散热器的生产成本。 除了传统的PC行业，现在新的散热方案就是去掉传统的散热器，将结构件和散热器统一成散热结构件。在PCB布局中将散热芯片布局在背面，或在正面布局时，在需要散热的芯片周围开散热孔，将热量通过铜箔等导到PCB背面，然后通过导热硅胶片填充建立导热通道导到PCB下方或侧面的散热结构件（金属支架，金属外壳），对整体散热结构进行优化，同时也降低整个散热方案的成本.
Thermal conductivity of silica gel film thickness, hardness can be adjusted according to the different design, so it can bridge the radiating structure in the conduction channel, chip size tolerance, reduce the requirements on the contact surface of the radiator industry structure design, especially for flatness, roughness of the working poor, the processing size industrial radiator industry high yield difference is +/-0.25mm, the flatness is 0.15mm/30mmx30mm, if improve machining accuracy will increase the product cost to a great extent, the contact area of the thermal conductivity of silica gel film can increase the heating unit and the cooling device, reduce the production cost of the radiator. In addition to the traditional PC industry, now the new cooling solution is to remove the traditional radiator, the radiator structure and unified into the radiating structure. In the PCB layout, radiating chip layout on the back, or in front of the layout, opened with the heat dissipation holes around the need to heat the chip, through the copper conducting heat back to the PCB, and then through the heat conducting silicon film filling the establishment of thermal channel guide to the radiating structure below PCB or side (metal stents, metal shell), for optimization on the whole radiating structure, but also reduce the cooling solution cost.